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boxDEP

Introduction

The boxDEP Physical Vapour Deposition (PVD) system

is our ultimate R&D platform due to the flexibility of

the substrate sizes, throughput & sources available.

Built for larger substrates, higher throughput, flexibility

and ease of use, it is the platform of choice for R&D &

Pilot production applications. 


Why boxDEP?

- Larger chamber with maximum flexibility

- High-vacuum performance with rapid pump-down

- Manual or fully automated operation

- Intuitive software with22” touchscreen control system

- Engineered for minimal out gassing & stability

- Designed  & built in Australia with 2-year warrant


KeyApplications

- Quantum & Photonic Devices

- Wearable electronics

- Photovoltaics & perovskite solar cells

- OLEDs, OPVs &OFETs

- Thin-film research & nano fabrication

Specifications

Substrate Size & Uniformity

12”(250mm) Diamter max– Multiple wafers optional

+/-5% uniformity

Base Pressure

<5x10-7mbar(3.75 X 10-7Torr)


Deposition Source Types

- High Temperature Thermal Boat/Crucibles

- Low Temperature Organics

- 2” or 3”Magnetron Sputtering (DC,RF,PulsedDC,

HiPIMS)

- E-Beam Evaporation (multi-pocket)

- Ion Source 

Typical Materials

- High Temperature Thermal =Au,Ag,Cu,Cr,Al…etc

- Organics = Small molecules ALQ3,C60…etc

- Sputtering = Metals, Oxides or Nitrides

- E-Beam = Ti, Pt, W, SiO2... etc 

Deposition Control

- Quartz Crystal monitor for either film monitoring

or thickness control with PID loop

- Optical Emission Spectroscopy

Substrate Heating/Cooling

- Heating to 1000°C

- Cooling to room temperature or optional -5°C

Vacuum Pumping

- 1450l/s Turbomolecular pump with market

leading pumping speeds for light gases or Cryogenic pump options

- Optional oil sealed or oil free scroll backing

pump

Warranty

2 Years

Country of Manufacture

Australia

boxDEP Brochure (pdf)

Download
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