
The boxDEP Physical Vapour Deposition (PVD) system
is our ultimate R&D platform due to the flexibility of
the substrate sizes, throughput & sources available.
Built for larger substrates, higher throughput, flexibility
and ease of use, it is the platform of choice for R&D &
Pilot production applications.
Why boxDEP?
- Larger chamber with maximum flexibility
- High-vacuum performance with rapid pump-down
- Manual or fully automated operation
- Intuitive software with22” touchscreen control system
- Engineered for minimal out gassing & stability
- Designed & built in Australia with 2-year warrant
KeyApplications
- Quantum & Photonic Devices
- Wearable electronics
- Photovoltaics & perovskite solar cells
- OLEDs, OPVs &OFETs
- Thin-film research & nano fabrication
12”(250mm) Diamter max– Multiple wafers optional
+/-5% uniformity
<5x10-7mbar(3.75 X 10-7Torr)
- High Temperature Thermal Boat/Crucibles
- Low Temperature Organics
- 2” or 3”Magnetron Sputtering (DC,RF,PulsedDC,
HiPIMS)
- E-Beam Evaporation (multi-pocket)
- Ion Source
- High Temperature Thermal =Au,Ag,Cu,Cr,Al…etc
- Organics = Small molecules ALQ3,C60…etc
- Sputtering = Metals, Oxides or Nitrides
- E-Beam = Ti, Pt, W, SiO2... etc
- Quartz Crystal monitor for either film monitoring
or thickness control with PID loop
- Optical Emission Spectroscopy
- Heating to 1000°C
- Cooling to room temperature or optional -5°C
- 1450l/s Turbomolecular pump with market
leading pumping speeds for light gases or Cryogenic pump options
- Optional oil sealed or oil free scroll backing
pump
2 Years
Australia
boxDEP Brochure (pdf)
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