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flexDEP

Introduction

 

The flexDEP Physical Vapour Deposition (PVD) system

is our most popular platform due to the flexibility of

the sources available.

Built for performance, flexibility and ease of use, it is

the platform of choice for R&D applications and open

access facilities.


Why flexDEP?

- Compact footprint with maximum flexibility

- High-vacuum performance with rapid pump-down

- Manual or fully automated operation

- Intuitive software with22” touchscreen control system

- Engineered for minimal out gassing & stability

- Designed & built in Australia with 2-year warrant


Key Applications

- Quantum & Photonic Devices

- Wearable electronics

- Photovoltaics & perovskite solar cells

- OLEDs, OPVs &OFETs

- Thin-film research & nano fabrication

Specifications

Substrate Size & Uniformity

6”(150mm)Diamter max – 8”(200mm) Optional

+/- 5% uniformity 

Base Pressure

<5x10-7mbar (3.75 X 10 -7Torr)

Deposition Source Types

- High Temperature ThermalBoat/Crucibles

- Low Temperature Organics

- 2”/3”/4” Magnetron Sputtering (DC,RF,PulsedDC,

HiPIMS)

- E-Beam Evaporation (multi-pocket)

- Ion Source

Typical Materials

- High Temperature Thermal=Au,Ag,Cu,Cr,Al…etc

- Organics= Small molecules ALQ3,C60…etc

- Sputtering= Metals, Oxides or Nitrides

- E-Beam=Ti,Pt,W,SiO2…etc

Mass Flow Controllers(Sputtering)

Ar plus up to 5x reactive gases(O2, N2, etc)

Deposition Control

- Quartz Crystal monitor for either film monitoring

or thickness control with PID loop

- Optical Emission Spectroscopy

Substrate Heating/Cooling

- Heating to 800°C

- Cooling to room temperature or optional -5°C

Warranty

2 Years

Country of Manufacture

Australia

flexDEP Brochure (pdf)

Download
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